SENSOR CHIP ASSEMBLY (SCA) FOR THE WFIRST PROJECT
$22,971,571
| Recipient | TELEDYNE SCIENTIFIC & IMAGING, LLC UEI WQKMXY9FRUC5 |
|---|---|
| Award ID | 80GSFC18C0095 |
| Award amount | $22,971,571 |
| Award type | DEFINITIVE CONTRACT |
| Awarding agency | National Aeronautics and Space Administration — National Aeronautics and Space Administration |
| NAICS | 334413 — SEMICONDUCTOR AND RELATED DEVICE MANUFACTURING |
| PSC | 6650 |
| Start date | Jun 14, 2018 |
| End date | Dec 31, 2021 |
| Place of performance | CAMARILLO, CA |
| Record updated | Mar 24, 2022 |
View the official award record
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